Rohde & Schwarz Audio Impedance Matching Module for TSVP including - Audio signal conditioning and impedance matching Network - Loudspeaker Load Resistors - Jumpers for configuration in 3 variants - TSVP front panel with DIN 41612 connector (f), 96 pins...
The Rohde & Schwarz 5038.8998.02 is an Audio Impedance Matching Module designed for use with the Test System Versatile Platform (TSVP). It provides audio signal conditioning and impedance matching, enabling precise adaptation of audio signals for test applications. The module features integrated loudspeaker load resistors and includes jumpers for configuration in three different variants, allowing flexible setup for various test scenarios. It is equipped with a TSVP front panel and a 96-pin DIN 41612 female connector, ensuring reliable integration into the TSVP system. This module is intended for professional audio testing environments where accurate impedance matching and signal conditioning are required.
