Rohde & Schwarz Audio Impedance Matching Module for TSVP including - Audio signal conditioning and impedance matching Network - Loudspeaker Load Resistors - Jumpers for configuration in 3 variants - TSVP front panel with DIN 41612 connector (f), 96 pins - A2B board...
The Rohde & Schwarz 5038.8998.04 is an Audio Impedance Matching Module designed for use with the Test System Versatile Platform (TSVP). This module provides audio signal conditioning and impedance matching networks, enabling precise adaptation of audio signals for testing purposes. It includes loudspeaker load resistors and configurable jumpers, allowing users to select among three different configuration variants. The module is equipped with a TSVP front panel featuring a 96-pin DIN 41612 female connector, ensuring reliable integration into the TSVP system. Additionally, it incorporates an A2B board for enhanced audio signal management. This module is intended for professional audio testing and measurement applications within the Rohde & Schwarz TSVP ecosystem.
